11/25/2015, 11:11 am
China's Jiangsu Changjiang Electronics Technology -- better known as JCET -- has won orders to assemble system-in-package (SiP) modules for Apple in 2016, sources said on Wednesday.
05/07/2015, 03:05 pm
A deeper inspection of the S1 system-in-package that powers Apple's new wearable reveals a plethora of parts packed into an impressively compact space, including a new Apple-designed application processor alongside components from Broadcom, Skyworks, and NXP.
04/30/2015, 12:04 pm
The first complete teardown of the S1 system-on-chip in the Apple Watch shows parts from a number of different manufacturers, including a Broadcom wireless chip, and memory from Elpida, Toshiba, and SanDisk, a detailed look inside the custom chip revealed on Thursday.