TSMC, Largan, Foxconn, Texas Instruments among mentioned suppliers
Apple suppliers are now engaged in "intensive delivery" of a "large number" of parts for a low-cost iPhone, says the Commercial Times. TSMC is reportedly delivering 28nm processors, while Largan Precision is supplying an 8-megapixel camera. Foxconn is providing a battery module and most of the inner frame, while Taiflex Scientific is handling a flexible circuit. Other suppliers are said to include Chipbond, Kinsus, SPIL, Texas Instruments, and Renesas Electronics.
Rumor has small iPad screens testing for tiny iPad
A rumored small iPad might have manifested itself if a purported leak is accurate. Both AU Optronics and LG Display were said by Taiwan's Economic Daily News to be sending Apple samples of a 7.85-inch touchscreen with the same 1024x768 resolution as the current, 9.7-inch iPad. Broadcom would supply the touchscreen's controller chipset, while Kinsus would make the substrate.
Kinsus leak gives iPhone 5 chipset, timing details
Some of the first iPhone 5 part details have emerged on Friday with insight into its launch timing. Taiwan's Kinsus is reportedly supplying 30 to 40 percent of the substrates for the Qualcomm chipsets that will provide cellular access. The Apple Daily sources had the iPhone 5 launching in spring and that Kinsus could by necessity ship its own parts as soon as this quarter, before the end of March.
2010 iPhone leans more on parts from Taiwan
Apple has switched up the suppliers in use for the new iPhone, a report by Taiwan's Economic Daily News paper said today. Foxconn will still put together the finished product, but Apple is now believed using three companies for the touch layer: Chimei Innolux is making 15 percent of the panels while the rest is split between Wintek and TPK. The American company is also leaning more heavily on Taiwan as a whole, as quartz maker TXC and laminate maker Taiflex Scientific are moving from less than a fifth of orders to 45 and 65 percent each.