toggle

AAPL Stock: 114.64 ( -3.8 )

Printed from http://www.macnn.com

Apple patents packaging with built-in electronics

updated 03:15 pm EDT, Thu April 5, 2012

Future Apple packaging may have sensors?

A new US patent from Apple suggests the iPhone maker wants to rethink the way products are packaged. Hardly an indication of a product due to ship anytime soon, the patent describes an "electrical trace" molded into or printed onto the packaging. The so-called "active electronic media device packaging" will also require at least one method of wireless power transmission to light up the package.

The patent application is fairly recent, as it was made on December 12, 2011. The patent would account for shoppers' contact, as well, as it discusses an integrated position, orientation, and movement (POM) sensor. It could be used to ensure the package switches on only when a potential customer walks by or isn't on when there is another product covering it on the shelf. [via Engadget]







by MacNN Staff

POST TOOLS:

TAGS :

toggle

Comments

Login Here

Not a member of the MacNN forums? Register now for free.

toggle

Network Headlines

Follow us on Facebook

toggle

Most Popular

Advertisement

Recent Reviews

HP 14-x030nr 14-inch Chromebook

If you're like us, chances are you've come to realize that you need the ability to access the Internet on the go. Also, you've prob ...

15-inch MacBook Pro with Force Touch

Apple's 15-inch Retina MacBook Pro continues to be a popular notebook with professional users and prosumers looking for the ultimate ...

Typo keyboard for iPad

Following numerous legal shenanigans between Typo -- a company founded in part by Ryan Seacrest -- and the clear object of his physica ...

toggle

Most Commented