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Intel Ivy Bridge power, chipset details slip

updated 07:45 am EDT, Fri October 21, 2011

Motherboard makers slip Ivy Bridge details

Details about Intel's forthcoming Ivy Bridge processors have slipped out. The next-generation processor architecture will be produced on a 22nm process and will feature an ultra-dense 3D transistor design Intel calls Tri-Gate. Although the chips aren't expected in shipping products until March 2012, Digitimes has unearthed some power consumption and chipset details from Taiwanese motherboard makers.

The quad-core Ivy Bridge variants will have thermal design power (TDP) ratings of 65W and 77W. Dual-core versions will consume 35W and 55W. The 7-series desktop CPU's will be launched with new Z77 and Z75 chipsets that will replace the Z68 and P67 chipsets. A chipset labeled as the H77 will replace the H67.
New business chipsets can also be expected with the Q77, Q75 and B75 will replace the Q67, Q65 and B65.

The new 22nm process is expected to bring speed and power benefits that are inherent in shifting from a 32nm process used for its current Sandy Bridge processors. Graphics performance is also expected to be boosted markedly over Intel's previous integrated solutions and is said to rival mid-range discrete processors.

by MacNN Staff



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