Apple files for patents covering notebook cooling tech
updated 08:55 pm EST, Thu March 4, 2010
Variety of new cooling methods explored
The US Patent Office is currently reviewing several of Apple's applications detailing technology for cooling and heat dissipation. One filing, initially submitted in September of 2008, describes a system for cooling devices using flow sensors. The technology is designed to help reduce heat by limiting the performance characteristics or using active cooling systems.
"Heat dissipation is an important consideration in the design of such electronic devices," the filing reads. "If this heat is not adequately dissipated, the electronic components may fail and/or cause damage to the electronic device."
The sensors, such as velocimeters and temperature sensors, could be placed near a cavity in a notebook housing to detect the flow and temperature of air. The velocity can then be adjusted as the computer generates more heat under heavy load.
A separate application details a system utilizing existing ports to increase airflow. Ports, such as USB and Ethernet connections, could be arranged to optimize the cooling effect.
Apple also filed for a patent involving cooling with conductive hinge assemblies. The hinges would provide a conductive connection between a computer part and a second housing designed to dissipate heat.
The last application describes a system using the "Peltier effect," a method that cools through an electrical current at the junction of two metals of different densities. The "solid state cooling mechanism" would use the technology to transfer heat away from a computer or other electronic device.
The USPTO has yet to approve the patent applications, although current MacBooks already appear to employ several of the cooling technologies described in the filings. [via AppleInsider]
