updated 04:35 pm EDT, Thu August 14, 2008
Power, thermal patents
Apple today filed two new patent applications with the US Patent and Trademark Office. The first, Conserving power by reducing voltage supplied to an instruction-processing portion of a processor, involves continuing a 2005 patent relating to techniques for saving power in computer systems. Specifically, it relates to reducing voltage supplied to an instruction-processing portion of a processor, while still maintaining voltage to other portions of a chipset.
The second application, Thermal interface for electronic chip testing, involves heat transfer techniques. Apple's particular interest lies in low-melting-point metal alloys, which can be used as a thermal interface while testing electronics.