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Infineon XMM 6180 3G Chip
Infineon on Friday introduced a 3G chipset that should provide much faster Internet performance with the iPhone next year. A combination of the XMM 6180 app processor and an X-GOLD 618 baseband for the connection itself, the chipset is one of the first from Infineon to support the full HSPA (High Speed Packet Access) spec for 3G cellular data. In peak conditions, the chipset can not only download at up to 7.2Mbps but upload much more quickly than older HSDPA hardware -- up to 2.9Mbps, Infineon claims.
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