3G iPhone due mid-year with Infineon chip?

The 3G iPhone is coming in the middle of 2008 with technology supplied by Infineon, says an analyst with the investment bank UBS. Nicolas Gaudois claims his statement is based on various checks, and particularly an HSDPA design win by Infineon set to ramp up during the second quarter of the year. This might not be of concern except that Infineon is said to also be ramping down EDGE chip production for the current 2.5G iPhone, with the intention of clearing out inventory.

The latter point may suggest that Apple does not intend to have EDGE-only options in future iPhones, a choice which could conceivably make sense if it decided to release a cheaper product than the $399 and $499 devices presently on sale. For the HSDPA technology, Infineon is said to be building the baseband controller, RF module, and power management unit.

Filed under: iPhone, Investor, Apple
Other story tags: 3G, Infineon, HSDPA, EDGE

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ZinkDifferent

No EDGE only? Really?

02/28, 12:52pm, EST

Two points here:

- "Duh!"

- oh, and there are no other chip suppliers withbEDGE capable chips in case Apple wanted to make an EDGE only device?

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Joined Jan 2005

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Grrr

"?"

02/28, 2:00pm, EST

I thought this was supposed to be for "news" not speculative crap. Sometimes I think Macnn has a bunch of 9 year olds working for it these days.

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Joined Jun 2001

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tindrum

quit reading

02/28, 7:23pm, EST

or is your browser stuck on MacNN, and someone broke off the knob? Sometimes, it's interesting or informative to hear what people are saying and speculating in relation to the company many people love, or love to hate.

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