AAPL Stock: 117.81 ( -0.22 )

Printed from

Samsung develops 4GB stacked memory

updated 08:30 am EDT, Mon April 23, 2007

Samsung Stacked RAM

Samsung this morning revealed that it had established a new, breakthrough method of creating RAM that should revolutionize the amount of storage and performance of virtually all computer memory. A new technique, dubbed a wafer-level-processed stacked package (WSP), allows the company to place memory chips on top of each other with virtually no space in between: rather than use wires that add bulk, the chips themselves contain laser-cut holes that are filled by copper links, joining each memory chip simply by placing one on top of another.

The process lets Samsung not only create stacked chips -- which result in a total of 4GB of memory on a single RAM stick -- but also creates the performance needed for next year's DDR3 memory, which could transfer as quickly as 1.6 gigabits per second per chip. The technology also has side benefits for size and power, the company adds.

No practical release dates were given for RAM available in mainstream computers, but the process isn't limited to DDR3 and should be available for any type of DDR computer memory in the near future.

by MacNN Staff




Login Here

Not a member of the MacNN forums? Register now for free.


Network Headlines

Follow us on Facebook


Most Popular


Recent Reviews

Ultimate Ears Megaboom Bluetooth Speaker

Ultimate Ears (now owned by Logitech) has found great success in the marketplace with its "Boom" series of Bluetooth speakers, a mod ...

Kinivo URBN Premium Bluetooth Headphones

We love music, and we're willing to bet that you do, too. If you're like us, you probably spend a good portion of your time wearing ...

Jamstik+ MIDI Controller

For a long time the MIDI world has been dominated by keyboard-inspired controllers. Times are changing however, and we are slowly star ...


Most Commented