updated 11:55 am EDT, Fri September 15, 2006
MaxUpgrades ships MaxSink
MaxUpgrades today began shipping MaxSink, a heat sink designed to provide effective heat dissipation of fully buffered DIMM memory modules operating at 533MHz or 667MHz. MaxSink's design can effectively dissipate heat generated from memory chips and Advance Memory Buffer on fully buffered modules while keeping the temperature within operating limits, according to MaxUpgrades. The heat sink is precision machined aluminum, and features unique mounting for uniform pressure distribution. The company boasts the lowest thermal resistance between DRAM chips (BGA) and the heat sink for optimized heat transfer with thermal conductive interface pads. The heat sink is designed for fluctuating memory module temperature variations with a step design to incorporate thickness variation of AMB and FBGA memory chips, and features a surface that is treated to minimize thermal resistance. MaxSink is available for $40.